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  1 d a t a s h e e t : c 3 d 0 3 0 6 0 a r e v . b C3D03060A Csilicon carbide schottky diode z -r ec ? r ectifier features ? 600-volt schottky rectifer ? optimized for pfc boost diode application ? zero reverse recovery current ? zero forward recovery voltage ? high-frequency operation ? temperature-independent switching behavior ? extremely fast switching ? positive temperature coeffcient on v f benefts ? replace bipolar with unipolar rectifers ? essentially no switching losses ? higher effciency ? reduction of heat sink requirements ? parallel devices without thermal runaway applications ? switch mode power supplies ? power factor correction - typical pfc p out : 300w-450w package to-220-2 maximum ratings symbol parameter value unit test conditions note v rrm repetitive peak reverse voltage 600 v v rsm surge peak reverse voltage 600 v v dc dc blocking voltage 600 v i f(avg) average forward current 3.0 a t c =160?c i frm repetitive peak forward surge current 18 13.5 a t c =25?c, t p =10 ms, half sine wave d=0.3 t c =110?c, t p =10 ms, half sine wave d=0.3 i fsm non-repetitive peak forward surge current 26 23 a t c =25?c, t p =10 ms, half sine wave d=0.3 t c =110?c, t p =10 ms, half sine wave d=0.3 i fsm non-repetitive peak forward surge current 100 a t c =25?c, t p =10 s, pulse p tot power dissipation 53 23 w t c =25?c t c =110?c t j , t stg operating junction and storage temperature -55 to +175 ?c to-220 mounting torque 1 8.8 nm lbf-in m3 screw 6-32 screw part number package marking C3D03060A to-220-2 c3d03060 pin 1 pin 2 case v rrm = 600 v i f(avg) = 3 a q c = 6.7 nc subject to change without notice. www.cree.com
2 C3D03060A rev. b electrical characteristics symbol parameter typ. max. unit test conditions note v f forward voltage 1.5 1.8 1.7 2.4 v i f = 3 a t j =25c i f = 3 a t j =175c i r reverse current 10 20 50 100 a v r = 600 v t j =25c v r = 600 v t j =175c q c total capacitive charge 6.7 nc v r = 600 v, i f = 3a d i /d t = 500 a/ s t j = 25c c total capacitance 155 13 12 pf v r = 0 v, t j = 25c, f = 1 mhz v r = 200 v, t j = 25?c, f = 1 mhz v r = 400 v, t j = 25?c, f = 1 mhz note: 1. this is a majority carrier diode, so there is no reverse recovery charge. thermal characteristics symbol parameter typ. unit r jc to-220 package thermal resistance from junction to case 2.8 c/w typical performance figure 1. forward characteristics figure 2. reverse characteristics 4.0 5.0 6.0 forward current current 25c 0.0 1.0 2.0 3.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 forward current forward voltage current 25c current 75c current 125c current 175c t j = 25c t j = 75c t j = 125c t j = 175c i f forward current (a) v f forward voltage (v) 6.0 5.0 4.0 3.0 2.0 1.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 8.0e - 06 1.0e-05 1.2e-05 1.4e-05 reverse current (a) current 25c 0.0e+00 2.0e-06 4.0e-06 6.0e-06 8.0e - 06 0 100 200 300 400 500 600 700 800 reverse current (a) reverse bias (v) current 25c current 75c current 125c current 175c 14 12 10 8 6 4 2 0 0 100 200 300 400 500 600 700 800 t j = 25c t j = 75c t j = 125c t j = 175 i r reverse current ( a) v r reverse voltage (v)
3 C3D03060A rev. b figure 3. current derating figure 5. transient thermal impedance figure 4. capacitance vs. reverse voltage typical performance 1 10 100 1000 80 70 60 50 40 30 20 10 0 c capacitance (pf) v r reverse voltage (v) time (s) zth (c/w) 15 20 25 30 peak forward current (a) C3D03060A current derating 0 5 10 15 20 25 30 25 50 75 100 125 150 175 i f(peak) peak forward current (a) t c case temperature ( c) C3D03060A current derating i f(peak) peak forward current (a) t c case temperature ( c ) * frequency > 1khz 25 50 75 100 125 150 175 30 25 20 15 10 5 0 10% duty* 30% duty* 50% duty* 70% duty* dc 50 60 70 80 capacitance (pf) capacitance 0 10 20 30 40 50 1 10 100 1000 capacitance (pf) reverse voltage
4 C3D03060A rev. b 70 60 50 40 30 20 10 0 power dissipation (w) t c case temperature ( c ) 25 50 75 100 125 150 175 figure 6. power derating typical performance 30.0 40.0 50.0 60.0 70.0 power dissipation (w) 0.0 10.0 20.0 30.0 40.0 50.0 60.0 70.0 25 50 75 100 125 150 175 power dissipation (w) t c case temperature (c) package dimensions package to-220-2 pin 1 pin 2 case pos inches millimeters min max min max a .381 .410 9.677 10.414 b .235 .255 5.969 6.477 c .100 .120 2.540 3.048 d .223 .337 5.664 8.560 e .590 .615 14.986 15.621 f .143 .153 3.632 3.886 g 1.105 1.147 28.067 29.134 h .500 .550 12.700 13.970 j r 0.197 r 0.197 l .025 .036 .635 .914 m .045 .055 1.143 1.397 n .195 .205 4.953 5.207 p .165 .185 4.191 4.699 q .048 .054 1.219 1.372 s 3 6 3 6 t 3 6 3 6 u 3 6 3 6 v .094 .110 2.388 2.794 w .014 .025 .356 .635 x 3 5.5 3 5.5 y .385 .410 9.779 10.414 z .130 .150 3.302 3.810 note: 1. dimension l, m, w apply for solder dip finish a c e d g h b j l m n f p q s t u v w x y m i n m a x m i n m a x a . 3 9 5 . 4 1 0 1 0 . 0 3 3 1 0 . 4 1 4 b . 2 3 5 . 2 5 5 5 . 9 6 9 6 . 4 7 7 c . 1 0 2 . 1 1 2 2 . 5 9 1 2 . 8 4 5 d . 3 3 7 . 3 3 7 8 . 5 6 0 8 . 5 6 0 e . 5 9 0 . 6 1 0 1 4 . 9 8 6 1 5 . 4 9 4 f . 1 4 9 . 1 5 3 3 . 7 8 5 3 . 8 8 6 g 1 . 1 2 7 1 . 1 4 7 2 8 . 6 2 6 2 9 . 1 3 4 h . 5 3 0 . 5 5 0 1 3 . 4 6 2 1 3 . 9 7 0 j l . 0 2 8 . 0 3 6 . 7 1 1 . 9 1 4 m . 0 4 5 . 0 5 5 1 . 1 4 3 1 . 3 9 7 n . 1 9 5 . 2 0 5 4 . 9 5 3 5 . 2 0 7 p . 1 7 0 . 1 8 0 4 . 3 1 8 4 . 5 7 2 q . 0 4 8 . 0 5 4 1 . 2 1 9 1 . 3 7 1 s 3 5 3 5 t 3 5 3 5 u 3 5 3 5 v . 1 0 0 . 1 1 0 2 . 5 4 2 . 7 9 4 w . 0 1 4 . 0 2 1 . 3 5 6 . 5 3 3 x 3 5 3 5 y . 3 9 5 . 4 1 0 1 0 . 0 3 3 1 0 . 4 1 4 z . 1 3 0 . 1 5 0 3 . 3 0 2 3 . 8 1 0 i n c h e s m i l l i m e t e r s p o s r 0 . 0 1 0 r 0 . 2 5 4 1 2 z
5 this product has not been designed or tested for use in, and is not intended for use in, applications implanted into the human body nor in applications in which failure of the product could lead to death, personal injury or property damage, including but not limited to equipment used in the operation of nuclear facilities, life-support machines, cardiac defbrillators or similar emergency medical equipment, aircraft navigation or communication or control systems, air traffc control systems, or weapons systems. copyright ? 2009-2010 cree, inc. all rights reserved. the information in this document is subject to change without notice. cree and the cree logo are registered trademarks and z-rec is a trademark of cree, inc. 5 C3D03060A rev. b cree, inc. 4600 silicon drive durham, nc 27703 usa tel: +1.919.313.5300 fax: +1.919.313.5451 www.cree.com/power recommended solder pad layout part number package marking C3D03060A to-220-2 c3d03060 the levels of environmentally sensitive, persistent biologically toxic (pbt), persistent organic pollutants (pop), or otherwise restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with eu directive 2002/95/ec on the restriction of the use of certain hazardous substances in electrical and electronic equipment (rohs), as amended through april 21, 2006. to-220-2 diode model note: t j = diode junction temperature in degrees celcius v t r t diode model csd04060 vf t = v t + if*r t v t= 0.965 + (t j * - 1.3*10 - 3 ) r t= 0.096 + (t j * 1.0 6 *10 - 3 ) v t = v t +if*r t v t = 1.01+(t j * -1.26*10 -3 ) r t = 0.14+(t j * 1.13*10 -3 )


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